Crystal Industry Innovation
With the r-surface of a lumbered crystal used as the reference. wafer-shaped pieces are cut out at the prescribed angle.
To confirm that the crystal is cut at the prescribed angle. the angle is measured by means of an X-ray angle checker.
Since frequency of AT-cut crystal is deter-mined by the thickness of the crystal piece, the thickness of the crystal pieces is made uniform by means of a surface lapping machine to raise the surface accuracy.
To prevent joining with other vibration modes and form being influenced by sub-vibrations, the external shape is properly corrected bi profiling.
To cause vibrations to occur at the center, the crystal piece is shaped into the form of a lens.
After removing the worked laver produced by precision lapping and beveling by etching, cleaning is carried out.
The electrode used for applying a electric field to the crystal piece is formed by vacuum metal deposition (Ag, etc.) on top of the crystal piece.
The crystal piece is secured to the base by such means as Ag paste, or soldering.
Final fine adjustment of the frequency is carried out, by performing vacuum metal deposition again while letting the crystal oscillate.
To suppress aging of the crystal piece, the inside of the holder is first made vacuum, or filled with such inactive gas N2.and then sealed with a cap.
The crystal pieces are inspected for their specifications including frequency deviation. frequency vs, temperature characteristics, equivaient resistance, hermitcity of seal and insulating properties.