Crystal Industry Innovation

MFG Process

Main Technical Support MFG Process

Quartz Crystal Units Manufacturing Turning Process

  • Measuring & Cutting

    With the r-surface of a lumbered crystal used as the reference. wafer-shaped pieces are cut out at the prescribed angle.

  • Measurement of Angle

    To confirm that the crystal is cut at the prescribed angle. the angle is measured by means of an X-ray angle checker.

  • Precision Lapping

    Since frequency of AT-cut crystal is deter-mined by the thickness of the crystal piece, the thickness of the crystal pieces is made uniform by means of a surface lapping machine to raise the surface accuracy.

  • Profiling

    To prevent joining with other vibration modes and form being influenced by sub-vibrations, the external shape is properly corrected bi profiling.

  • Bevel

    To cause vibrations to occur at the center, the crystal piece is shaped into the form of a lens.

  • Etching & Cleaning

    After removing the worked laver produced by precision lapping and beveling by etching, cleaning is carried out.

  • Electrode metal deposition

    The electrode used for applying a electric field to the crystal piece is formed by vacuum metal deposition (Ag, etc.) on top of the crystal piece.

  • Assembly

    The crystal piece is secured to the base by such means as Ag paste, or soldering.

  • Fine frequency adjustment

    Final fine adjustment of the frequency is carried out, by performing vacuum metal deposition again while letting the crystal oscillate.

  • Sealing

    To suppress aging of the crystal piece, the inside of the holder is first made vacuum, or filled with such inactive gas N2.and then sealed with a cap.

  • Completion inspection

    The crystal pieces are inspected for their specifications including frequency deviation. frequency vs, temperature characteristics, equivaient resistance, hermitcity of seal and insulating properties.